RS PRO 电子散热器, 铝制, 40 x 40 x 18mm, 8.2K/W, 胶粘箔片安装, 黑色, 用于High Powered semiconductor Devices, Optoelectronic Devices
- RS 库存编号:
- 750-0951
- 制造商:
- ABL Components
可享批量折扣
小计(1 件)*
RMB14.40
(不含税)
RMB16.27
(含税)
有库存
- 另外 94 件在 2026年6月01日 发货
**需要更多产品?**输入您需要的数量,点击“查看送货日期”,查看库存和送货信息。
单位 | 每单位 |
|---|---|
| 1 - 24 | RMB14.40 |
| 25 - 99 | RMB12.60 |
| 100 - 249 | RMB11.79 |
| 250 - 499 | RMB10.35 |
| 500 + | RMB9.72 |
* 参考价格
- RS 库存编号:
- 750-0951
- 制造商:
- ABL Components
产品技术参数
产品概述和技术数据表
法例与合规
产品详细信息
通过选择一个或多个属性来查找类似产品。
选择全部 | 属性 | 值 |
|---|---|---|
| 品牌 | ABL Components | |
| 使用于 | High Powered semiconductor Devices, Optoelectronic Devices | |
| 长度 | 40mm | |
| 宽度 | 40mm | |
| 高度 | 18mm | |
| 尺寸 | 40 x 40 x 18mm | |
| 热阻 | 8.2K/W | |
| 安装 | 胶粘箔片 | |
| 颜色 | 黑色 | |
| 包装类型 | BGA | |
| 材料 | 铝 | |
| 表面 | 阳极化处理 | |
| 选择全部 | ||
|---|---|---|
品牌 ABL Components | ||
使用于 High Powered semiconductor Devices, Optoelectronic Devices | ||
长度 40mm | ||
宽度 40mm | ||
高度 18mm | ||
尺寸 40 x 40 x 18mm | ||
热阻 8.2K/W | ||
安装 胶粘箔片 | ||
颜色 黑色 | ||
包装类型 BGA | ||
材料 铝 | ||
表面 阳极化处理 | ||
- COO (Country of Origin):
- GB
RS PRO Standard, Push Pin, Aluminium, BGA (Ball Grid Array) Heatsink, 8.2° C/W
From RS PRO this is a standard BGA (Ball Grid Array) Push Pin heatsink designed for excellent performance and precision easily integrating into your electronics, providing protection from circuits over heating maintaining operating temperatures, ensuring the reliable performance of your electronic devices. The aluminium heatsink is aluminium complete with anodized finish and is securely mounted by adhesive foil.
The RS PRO Heatsink is a vital component to maintain optimal temperature for your electronic components preventing overheating. When electronic components are working, they generate heat and if left the heat will build-up and can damage or reduce a components performance. The heatsink will absorb and dissipate the generated heat.
The RS PRO Heatsink is a vital component to maintain optimal temperature for your electronic components preventing overheating. When electronic components are working, they generate heat and if left the heat will build-up and can damage or reduce a components performance. The heatsink will absorb and dissipate the generated heat.
Features and Benefits
- BGA (Ball Grid Array) Heatsink
- Standard, Pushpin
- Made from aluminium
- Adhesive foil mounting
- Anodized finish
- For use with Universal rectangular Alu
- Thermal resistance 8.2° C/W
- Dimensions 40 mm L x 40 mm W x 18 mm H
Applications
- Surface mount chip cooling
- High powered semiconductors
- Optoelectronic devices and many more
Thermal Resistance
The thermal resistance for the BGA heatsink is calculated based on a distributed heat load and vertically mounted fins anodized heatsink with a 60°C temperature.
Why RS PRO?
RS PRO is the own brand of RS. The RS PRO Seal of Approval is your assurance of professional quality, a guarantee that every part is rigorously tested, inspected, and audited against demanding standards. Making RS PRO the Smart Choice for our customers.
